| 型号 |
描述 |
品牌 |
年份 |
数量 |
发布日期 |
| GF114-325-A1 |
GTX560 MVD 45X35MM 1711PIN FCBGANO |
|
|
1082 |
2026/2/7 |
| GF114-400-A1 |
GTX560 MVD 45X35MM 1711PIN FCBGA NO |
|
|
552 |
2026/2/7 |
| CG82NM10 |
HDCP SLGXX INTEL NM10 FCBGA 360PIN |
|
|
1469 |
2026/2/7 |
| IDGV1G-05A1F1C-40X |
1GB 32MX32 4.0GBPS GDDR5 TFBGA 170PIN/CHINA OEM |
QIMONDA |
|
788 |
2026/2/7 |
| K4N51163QZ-HC20 |
32MX16-2.0 Z-DIE 500MHZ DDR2 FBGA 84PIN/CHINA OEM |
SAMSUNG |
|
3002 |
2026/2/7 |
| IDGV51-05A1F1C-40X |
512MB GDDR5 16MX32 4.0GBPS TFBGA 170PIN/CHINA OEM |
QIMONDA |
|
286 |
2026/2/7 |
| K4J52324QH-HJ08 |
16MX32-0.8 H-DIE 1.2GHZ GDDR3 FBGA 136PIN AFTER DATE CODE 0840 /CHINA OEM |
SAMSUNG |
|
2207 |
2026/2/7 |
| RAMK4N51163QZ-HC25 |
32MX16-2.5 Z-DIE GDDR2 FBGA 84PIN/CHINA OEM |
SAMSUNG |
|
1811 |
2026/2/7 |
| K4N1G164QQ-HC25 |
64MX16-2.5 Q-DIE GDDR2 FBGA 84PIN/CHINA OEM |
SAMSUNG |
|
418 |
2026/2/7 |
| K4N1G164QQ-HC20 |
64MX16-2.0 Q-DIE GDDR2 FBGA 84PIN/CHINA OEM |
SAMSUNG |
|
632 |
2026/2/7 |
| HYB18H512321B2F-14 |
16MX32-1.4 GDDR3 FG-TFBGA 136PIN/CHINA OEM |
QIMONDA |
|
259 |
2026/2/7 |
| H5PS5162FFR-20C |
32MX16-2.0 DDR2 FBGA 84PIN/CHINA OEM |
HYNIX |
|
1664 |
2026/2/7 |
| H5RS5223CFR-N0C |
16MX32 GDDR3 FBGA 136PIN/CHINA OEM |
HYNIX |
|
3970 |
2026/2/7 |
| K4U52324QE-BC08 |
16MX32-0.8 DDR4 FBGA 136PIN/HP |
SAMSUNG |
|
208 |
2026/2/7 |
| HYB18H1G321AF-10 |
32MX32-1.0 A-DIE GDDR3 PG-TFBGA-136PIN FOR CHINA OEM |
QIMONDA |
|
684 |
2026/2/7 |
| HY5PS561621BFP-25 |
16MX16-2.5 DDR2 BGA 84PIN/CHINA OEM |
HYNIX |
|
563 |
2026/2/7 |
| GF8500GT |
G86-303-A2 BGA 33X33MM 820PIN/TF |
|
|
352 |
2026/2/7 |
| K4J52324QE-BJ1A |
16MX32-1.0 GDDR3 136PIN FBGA\CHINA |
|
|
1062 |
2026/2/7 |
