| 型号 |
描述 |
品牌 |
年份 |
数量 |
发布日期 |
| K4N1G164QF-BC20 |
64MX16-2.0 GDDR2 F-DIE FBGA 84PIN FOR PCP |
SAMSUNG |
|
400 |
2026/2/7 |
| K4N1G164QF-BC20 |
64MX16-2.0 GDDR2 F-DIE FBGA 84PIN FOR CHINA OEM |
SAMSUNG |
|
566 |
2026/2/7 |
| H5GQ1H24AFR-T2C |
1GB 32MX32-5.0 GBPS 54NM GDDR5 BGA 170PIN FOR CHINA OEM |
SAMSUNG |
|
813 |
2026/2/7 |
| K4G10325FE-HC04 |
1GB 32MX32 GDDR5 5.0GBPS 1.5V 56NM FBGA 170PIN FOR SAMSUNG |
SAMSUNG |
|
1668 |
2026/2/7 |
| K4G10325FE-HC04 |
1GB 32MX32 GDDR5 5.0GBPS 1.5V 56NM FBGA 170PIN FOR CHINA OEM |
SAMSUNG |
|
3258 |
2026/2/7 |
| K4G10325FE-HC05 |
32MX32 GDDR5 4.0GBPS 1.5V FCBGA 170PIN/CHINA OEM |
SAMSUNG |
|
2266 |
2026/2/7 |
| K4G10325FE-HC05 |
32MX32 GDDR5 4.0GBPS 1.5V FCBGA 170PIN/ACER |
SAMSUNG |
|
240 |
2026/2/7 |
| KT1G16000413-25 |
64MX16-2.5 1GB GDDR2 SDRAM 84 BALL FOR CHINA OEM |
KRETON |
|
184 |
2026/2/7 |
| K4J10324KE-HC1A |
GDDR3 32MX32-1.0 FBGA 136PIN FOR CHINA OEM |
SAMSUNG |
|
532 |
2026/2/7 |
| H5GQ1H24AFR-T0C |
1GB 32MX32 4.0GBPS 2.0GHZ GDDR5 BGA 170PIN/CHINA OEM NO |
HYNIX |
|
1718 |
2026/2/7 |
| K4W1G1646E-HC12 |
64MX16-1.2 E-DIE 800MHZ GDDR3 FBGA 96PIN FOR TF |
SAMSUNG |
|
408 |
2026/2/7 |
| K4W1G1646E-HC12 |
64MX16-1.2 E-DIE 800MHZ GDDR3 FBGA 96PIN FOR CHINA OEM |
SAMSUNG |
|
327 |
2026/2/7 |
| K4N1G164QE-HC20 |
64MX16-2.0 DDR2 500 MHZ E-DIE FBGA 84BALL FOR ACER |
SAMSUNG |
|
2057 |
2026/2/7 |
| K4N1G164QE-HC20 |
64MX16-2.0 DDR2 500 MHZ E-DIE FBGA 84BALL FOR CHINA OEM |
SAMSUNG |
|
3231 |
2026/2/7 |
| K4N1G164QE-HC20 |
64MX16-2.0 DDR2 500 MHZ E-DIE FBGA 84BALL FOR SAMSUNG |
SAMSUNG |
|
626 |
2026/2/7 |
| H5RS5223CFR-N3C |
512MBIT 16MX32 GDDR3 1300MHZ SDRAM 136PIN FOR CHINA OEM |
HYNIX |
|
1059 |
2026/2/7 |
| K4J52324QH-HJ1A |
16MX32-1.0 H-DIE GDDR3 FBGA 136PIN RAM DATE CODE AFTER 0840/CHINA OEM |
SAMSUNG |
|
3141 |
2026/2/7 |
| GF114-326-A1 |
GTX560 MVD 45X35MM FCBGA 1711PIN |
|
|
678 |
2026/2/7 |
